| US 9,812,627 B2 | ||
| Light emitting device | ||
| Ryohei Yamashita, Tokushima (JP); and Shimpei Sasaoka, Itano-gun (JP) | ||
| Assigned to NICHIA CORPORATION, Anan-shi (JP) | ||
| Filed by NICHIA CORPORATION, Anan-shi (JP) | ||
| Filed on Jan. 27, 2017, as Appl. No. 15/417,226. | ||
| Claims priority of application No. 2016-012956 (JP), filed on Jan. 27, 2016. | ||
| Prior Publication US 2017/0213945 A1, Jul. 27, 2017 | ||
| Int. Cl. H01L 29/26 (2006.01); H01L 33/62 (2010.01); H01L 33/54 (2010.01) | ||
| CPC H01L 33/62 (2013.01) [H01L 33/54 (2013.01)] | 15 Claims |
| 1. A light emitting device comprising:
a resin package comprising:
a first lead;
a second lead; and
a molded body molded integrally with the first lead and the second lead;
a light emitting element provided on the resin package and comprising:
a first electrode disposed to face the first lead and including a first post electrode projecting toward the first lead in
a first projecting direction with a height equal to or larger than 50 μm and equal to or smaller than 150 μm in the first
projecting direction; and
a second electrode disposed to face the second lead and including a second post electrode projecting toward the second lead
in a second projecting direction with a height equal to or larger than 50 μm and equal to or smaller than 150 μm in the second
projecting direction;
a first electrically conductive bonding member connecting the first lead and the first post electrode; and
a second electrically conductive bonding member connecting the second lead and the second post electrode.
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