US 9,812,625 B2
Light-emitting device having resin member with conductive particles
Tadaaki Miyata, Yokohama (JP)
Assigned to NICHIA CORPORATION, Anan-Shi (JP)
Filed by Nichia Corporation, Anan-shi (JP)
Filed on Feb. 18, 2015, as Appl. No. 14/625,167.
Claims priority of application No. 2014-028310 (JP), filed on Feb. 18, 2014; and application No. 2014-089145 (JP), filed on Apr. 23, 2014.
Prior Publication US 2015/0236230 A1, Aug. 20, 2015
Int. Cl. H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 33/0095 (2013.01); H01L 33/48 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A light-emitting device comprising:
a support including a substrate, a pair of electrodes, and an insulating reflective member, the pair of electrodes being disposed on an upper surface of the substrate, and the reflective member being disposed on the substrate;
a light-emitting element flip-chip mounted on the pair of electrodes; and
a resin member disposed at least between the light-emitting element and the reflective member, the resin member comprising a plurality of conductive particles dispersed in an insulating resin,
wherein the reflective member is disposed at least over an entirety of a surface that is located immediately below the resin member, and
wherein at least some of the conductive particles are electrically connecting particles, which electrically connect the light-emitting device to the pair of electrodes,
wherein the electrically connecting particles penetrate the reflective member, such that a first portion of each electrically connecting particle is located in the resin member, and a second portion of each electrically connecting particle is located in the reflective member, and
wherein the light-emitting element includes a top surface, a bottom surface, and a plurality of lateral surfaces, and wherein the top surface and at least portions of the lateral surfaces of the light-emitting element are exposed from the resin member.