US 9,812,620 B2
Light emitting device and method of manufacturing the light emitting device
Yusuke Kawano, Anan (JP)
Assigned to NICHIA CORPORATION, Anan-Shi (JP)
Filed by NICHIA CORPORATION, Anan-shi, Tokushima (JP)
Filed on Oct. 27, 2016, as Appl. No. 15/336,115.
Claims priority of application No. 2015-215254 (JP), filed on Oct. 30, 2015; application No. 2016-146599 (JP), filed on Jul. 26, 2016; and application No. 2016-169836 (JP), filed on Aug. 31, 2016.
Prior Publication US 2017/0125653 A1, May 4, 2017
Int. Cl. H01L 33/00 (2010.01); H01L 21/00 (2006.01); H01L 33/58 (2010.01); H01L 27/15 (2006.01); H01L 33/54 (2010.01); H01L 33/50 (2010.01)
CPC H01L 33/58 (2013.01) [H01L 27/156 (2013.01); H01L 33/504 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 2933/005 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A light emitting device comprising:
a substrate;
a first frame located on the substrate;
a second frame located on the substrate, the second frame being located inward of and spaced apart from the first frame;
at least one first light emitting element located on the substrate in a first region located between the first frame and the second frame;
at least one second light emitting element located on the substrate in a second region located inward of the second frame; and
a sealing member covering the at least one first light emitting element and the at least one second light emitting element;
wherein the second frame includes a light-transmissive portion;
wherein a highest portion of the second frame is higher than a highest portion of the first frame;
wherein an upper surface of a portion of the sealing member in the first region is formed such that a portion closer to the first frame is lower than a portion closer to the second frame; and
wherein an upper surface of a portion of the sealing member in the second region is formed higher than the lowest portion of the upper surface of the sealing member in the first region.