US 9,812,619 B2
Optoelectronic component and method for producing same
Jürgen Moosburger, Lappersdorf (DE); Thomas Schwarz, Regensburg (DE); Hans-Jürgen Lugauer, Sinzing (DE); Tansen Varghese, Regensburg (DE); and Stefan Illek, Donaustauf (DE)
Assigned to OSRAM Opto Semiconductors GmbH, Regensburg (DE)
Appl. No. 14/769,060
Filed by OSRAM Opto Semiconductors GmbH, Regensburg (DE)
PCT Filed Jan. 15, 2014, PCT No. PCT/EP2014/050701
§ 371(c)(1), (2) Date Aug. 19, 2015,
PCT Pub. No. WO2014/127934, PCT Pub. Date Aug. 28, 2014.
Claims priority of application No. 10 2013 202 910 (DE), filed on Feb. 22, 2013.
Prior Publication US 2016/0013380 A1, Jan. 14, 2016
Int. Cl. H01L 29/18 (2006.01); H01L 33/58 (2010.01); H01L 33/54 (2010.01); H01L 21/78 (2006.01); H01L 25/075 (2006.01); H01L 25/00 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/58 (2013.01) [H01L 21/78 (2013.01); H01L 25/0753 (2013.01); H01L 25/50 (2013.01); H01L 33/005 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An optoelectronic component comprising:
an optoelectronic semiconductor chip obtained by cleaving an optoelectronic semiconductor wafer, the optoelectronic semiconductor chip having a first surface formed of a first surface of the optoelectronic semiconductor wafer and a second surface formed of a second surface of the optoelectronic semiconductor wafer; and
a mold body having a bottom surface and an upper surface, wherein the optoelectronic semiconductor chip is embedded in the mold body,
wherein the first surface of the optoelectronic semiconductor chip is accessible at the upper surface of the mold body,
wherein the upper surface of the mold body is elevated with regard to the first surface of the optoelectronic semiconductor chip, and
wherein the second surface is accessible at the bottom surface of the mold body and is flush with the bottom surface of the mold body.