| US 9,812,601 B2 | ||
| Solar celll | ||
| Anthony Lochtefeld, Ipswich, MA (US) | ||
| Assigned to Amberwave Inc., Salem, NH (US) | ||
| Filed by Anthony Lochtefeld, Ipswich, MA (US) | ||
| Filed on Mar. 17, 2014, as Appl. No. 14/217,045. | ||
| Claims priority of provisional application 61/799,148, filed on Mar. 15, 2013. | ||
| Prior Publication US 2014/0261652 A1, Sep. 18, 2014 | ||
| Int. Cl. H01L 21/00 (2006.01); H01L 31/0687 (2012.01); H01L 31/18 (2006.01) | ||
| CPC H01L 31/0687 (2013.01) [H01L 31/1852 (2013.01); Y02E 10/544 (2013.01); Y02P 70/521 (2015.11)] | 11 Claims |
| 1. A method of making a multi junction solar cell comprising the actions of:
providing a silicon substrate;
etching a first surface of the silicon substrate;
depositing a dielectric layer on the first surface of the silicon substrate;
etching a second surface of the silicon substrate wherein the dielectric layer masks the first surface during the action of
etching a second surface of the silicon substrate;
depositing a silicon germanium graded buffer layer on the second surface of the substrate;
depositing a first solar subcell base layer and a first solar subcell emitter layer within or on top of the graded buffer
layer; and
depositing a second solar subcell base layer and a second solar subcell emitter layer of GaAsP or other III-V material on
top of the first solar subcell base layer and the first solar subcell emitter layer.
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