US 9,812,580 B1
Deep trench active device with backside body contact
Sinan Goktepeli, San Diego, CA (US); and Steve Fanelli, San Marcos, CA (US)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Sep. 6, 2016, as Appl. No. 15/257,823.
Int. Cl. H01L 27/108 (2006.01); H01L 29/786 (2006.01); H01L 29/06 (2006.01); H01L 23/522 (2006.01); H01L 23/66 (2006.01); H01L 21/762 (2006.01); H01Q 1/38 (2006.01); H01Q 1/24 (2006.01)
CPC H01L 29/78615 (2013.01) [H01L 21/76251 (2013.01); H01L 23/5223 (2013.01); H01L 23/66 (2013.01); H01L 29/0649 (2013.01); H01Q 1/241 (2013.01); H01Q 1/38 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01)] 25 Claims
OG exemplary drawing
 
1. An integrated circuit, comprising:
a gate including a plurality of gate fingers;
a body including a plurality of semiconductor pillars interlocking with the plurality of gate fingers;
at least one backside contact coupled to the body; and
a backside metallization coupled to the body through the at least one backside contact.