US 9,812,541 B2
Array substrate, method for fabricating the same and display device
Guangcai Yuan, Beijing (CN)
Assigned to BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 14/422,321
Filed by BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Mar. 25, 2014, PCT No. PCT/CN2014/074032
§ 371(c)(1), (2) Date Feb. 18, 2015,
PCT Pub. No. WO2015/100859, PCT Pub. Date Jul. 9, 2015.
Claims priority of application No. 2014 1 0003682 (CN), filed on Jan. 3, 2014.
Prior Publication US 2016/0027886 A1, Jan. 28, 2016
Int. Cl. H01L 29/78 (2006.01); H01L 29/423 (2006.01); H01L 27/12 (2006.01); H01L 29/24 (2006.01); H01L 29/51 (2006.01); H01L 29/786 (2006.01)
CPC H01L 29/42384 (2013.01) [H01L 27/1225 (2013.01); H01L 27/1285 (2013.01); H01L 27/1288 (2013.01); H01L 29/24 (2013.01); H01L 29/513 (2013.01); H01L 29/517 (2013.01); H01L 29/518 (2013.01); H01L 29/7869 (2013.01); H01L 29/78606 (2013.01); H01L 29/78696 (2013.01); H01L 2029/42388 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A method for fabricating an array substrate, wherein the array substrate comprises a first TFT and a pixel electrode, the method comprising:
forming a buffer layer on a substrate; and
depositing an active layer film, a source/drain metal film and a transparent electrode layer on the substrate having the buffer layer formed thereon, and forming patterns of an active layer, a source/drain electrode and a pixel electrode of the first TFT through a single patterning process.