US 9,812,517 B2
Method for manufacturing display device and method for manufacturing electronic device
Minato Ito, Kanagawa (JP); and Yasuhiro Jinbo, Kanagawa (JP)
Assigned to Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken (JP)
Filed by Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken (JP)
Filed on May 24, 2016, as Appl. No. 15/163,072.
Claims priority of application No. JAPAN 2015-108191 (JP), filed on May 28, 2015.
Prior Publication US 2016/0351641 A1, Dec. 1, 2016
Int. Cl. H01L 27/12 (2006.01); H01L 27/32 (2006.01); H01L 51/00 (2006.01)
CPC H01L 27/3248 (2013.01) [H01L 27/124 (2013.01); H01L 27/1259 (2013.01); H01L 51/0097 (2013.01); H01L 2227/323 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A method for manufacturing a display device, comprising:
a first step of preparing a process member comprising:
providing a terminal electrode, a wiring, and a functional layer over a first substrate, wherein the terminal electrode, the wiring, and the functional layer are electrically connected to one another;
providing an insulating layer over the terminal electrode;
providing a first layer over the terminal electrode and the insulating layer; and
providing an adhesive layer sandwiched between the first substrate and a second substrate,
wherein the second substrate and the adhesive layer comprise a first opening in a region overlapping with part of the first layer, and
wherein the insulating layer comprises a second opening inside the first opening in a top view; and
a second step of removing part of the first layer,
wherein part of the first layer is removed by emitting particles to the first layer, so that the terminal electrode is exposed.