US 9,812,510 B1
Packaging organic photodetectors
Kwang Hyup An, Rexford, NY (US); and Jie Jerry Liu, Niskayuna, NY (US)
Assigned to General Electric Company, Niskayuna, NY (US)
Filed by General Electric Company, Schenectady, NY (US)
Filed on Dec. 14, 2016, as Appl. No. 15/378,948.
Int. Cl. H01L 27/30 (2006.01); H01L 51/44 (2006.01)
CPC H01L 27/308 (2013.01) [H01L 51/448 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method for packaging an organic photodetector, comprising:
providing a multilayer structure disposed on a portion of a substrate to form the organic photodetector; wherein the multilayer structure comprises:
a thin film transistor (TFT) array;
an organic photodiode disposed on the TFT array; and
a scintillator layer disposed on the organic photodiode;
providing a casing having at least one wall and an open end, wherein the casing comprises at least one aperture in the at least one wall;
sealing the open end of the casing with the substrate to enclose the multilayer structure in a volume such that the least one aperture is located in a path of radiation to an inactive region of the organic photodetector;
evacuating the volume through the at least one aperture; and
closing the at least one aperture after evacuating the volume to form a detector package.