| US 9,812,510 B1 | ||
| Packaging organic photodetectors | ||
| Kwang Hyup An, Rexford, NY (US); and Jie Jerry Liu, Niskayuna, NY (US) | ||
| Assigned to General Electric Company, Niskayuna, NY (US) | ||
| Filed by General Electric Company, Schenectady, NY (US) | ||
| Filed on Dec. 14, 2016, as Appl. No. 15/378,948. | ||
| Int. Cl. H01L 27/30 (2006.01); H01L 51/44 (2006.01) | ||
| CPC H01L 27/308 (2013.01) [H01L 51/448 (2013.01)] | 11 Claims |
| 1. A method for packaging an organic photodetector, comprising:
providing a multilayer structure disposed on a portion of a substrate to form the organic photodetector; wherein the multilayer
structure comprises:
a thin film transistor (TFT) array;
an organic photodiode disposed on the TFT array; and
a scintillator layer disposed on the organic photodiode;
providing a casing having at least one wall and an open end, wherein the casing comprises at least one aperture in the at
least one wall;
sealing the open end of the casing with the substrate to enclose the multilayer structure in a volume such that the least
one aperture is located in a path of radiation to an inactive region of the organic photodetector;
evacuating the volume through the at least one aperture; and
closing the at least one aperture after evacuating the volume to form a detector package.
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