US 9,812,484 B2
Image pickup apparatus, image pickup system, and method for manufacturing image pickup apparatus
Hideaki Ishino, Fujisawa (JP); and Katsunori Hirota, Yamato (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed on May 17, 2016, as Appl. No. 15/156,791.
Claims priority of application No. 2015-101335 (JP), filed on May 18, 2015.
Prior Publication US 2016/0343750 A1, Nov. 24, 2016
Int. Cl. H04N 5/225 (2006.01); H01L 27/146 (2006.01)
CPC H01L 27/1463 (2013.01) [H01L 27/14614 (2013.01); H01L 27/14623 (2013.01); H01L 27/14636 (2013.01); H01L 27/14698 (2013.01); H01L 27/14643 (2013.01); H01L 27/14689 (2013.01)] 20 Claims
OG exemplary drawing
1. An image pickup apparatus comprising a semiconductor layer that constitutes a pixel circuit region and a peripheral circuit region, wherein
an element isolation portion is disposed in the pixel circuit region and the peripheral circuit region, defines an element portion of the semiconductor layer, and contains an insulator, and
the element isolation portion in the pixel circuit region has a hydrogen concentration 10 times or more higher than a hydrogen concentration of the element isolation portion in the peripheral circuit region.