US 9,812,479 B2
Solid-state image sensor and electronic device
Shinji Miyazawa, Kanagawa (JP); and Yutaka Ooka, Kanagawa (JP)
Assigned to Sony Corporation, Tokyo (JP)
Filed by SONY CORPORATION, Tokyo (JP)
Filed on Mar. 31, 2017, as Appl. No. 15/476,554.
Application 15/476,554 is a continuation of application No. 15/015,984, filed on Feb. 4, 2016.
Application 15/015,984 is a continuation of application No. 14/011,193, filed on Aug. 27, 2013, granted, now 9,257,474.
Claims priority of application No. 2012-203069 (JP), filed on Sep. 14, 2012.
Prior Publication US 2017/0207266 A1, Jul. 20, 2017
Int. Cl. H01L 27/00 (2006.01); H01L 27/146 (2006.01)
CPC H01L 27/14618 (2013.01) [H01L 27/14621 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/14645 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A package comprising:
a glass substrate;
a semiconductor substrate having a first side as a light-incident side and a second side opposite to the first side;
a protection layer between the glass substrate and the first side of the semiconductor substrate;
a color filter at the first side of the semiconductor substrate;
a microlens layer over the color filter; and
a resin region including a first part of the resin region and a second part of the resin region,
wherein,
the first part of the resin region includes resin material between the microlens layer and the glass substrate,
the second part of the resin region includes resin material below a plane that is coincident with the first side of the semiconductor substrate and in a direction toward the second side of the semiconductor substrate, and
the resin region extends beyond an edge of the protection layer in a direction parallel to the first side of the semiconductor substrate.