US 9,812,478 B2
Aerogel-encapsulated image sensor and manufacturing method for same
Chun-Sheng Fan, Zhudong Township (TW); and Wei-Feng Lin, HsinChu (TW)
Assigned to OmniVision Technologies, Inc., Santa Clara, CA (US)
Filed by OmniVision Technologies, Inc., Santa Clara, CA (US)
Filed on Mar. 5, 2015, as Appl. No. 14/639,610.
Prior Publication US 2016/0260760 A1, Sep. 8, 2016
Int. Cl. H01L 31/0216 (2014.01); H01L 27/146 (2006.01)
CPC H01L 27/14618 (2013.01) [H01L 27/14636 (2013.01); H01L 27/14698 (2013.01); H01L 27/14627 (2013.01); H01L 2224/11 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An aerogel-encapsulated image sensor comprising:
a device die having an image sensor that includes a plurality of pixels forming a pixel array;
an aerogel layer that encapsulates the image sensor such that the pixel array is between a bottom surface of the device die and the aerogel layer; and
a microlens array that includes a plurality of microlenses, each microlens aligned to a respective one of the plurality of pixels, the microlens array being between the pixel array and a region of the aerogel layer that (a) is located directly above the pixel array and (b) has a top outer surface that is part of a top outer surface of the aerogel-encapsulated image sensor.