US 9,812,433 B2
Batch process fabrication of package-on-package microelectronic assemblies
Belgacem Haba, Saratoga, CA (US); Ilyas Mohammed, Santa Clara, CA (US); and Liang Wang, Milpitas, CA (US)
Assigned to Invensas Corporation, San Jose, CA (US)
Filed by Invensas Corporation, San Jose, CA (US)
Filed on May 12, 2016, as Appl. No. 15/153,188.
Application 14/953,565 is a division of application No. 14/230,388, filed on Mar. 31, 2014, granted, now 9,214,454, issued on Dec. 15, 2015.
Application 15/153,188 is a continuation of application No. 14/953,565, filed on Nov. 30, 2015, granted, now 9,356,006.
Prior Publication US 2016/0260696 A1, Sep. 8, 2016
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/48 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01)
CPC H01L 25/50 (2013.01) [H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/13 (2013.01); H01L 23/3157 (2013.01); H01L 23/5389 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 2224/131 (2013.01); H01L 2224/133 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06544 (2013.01); H01L 2225/06582 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15333 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A microelectronic assembly, comprising:
first and second support elements each having a first surface facing in an outward direction of the assembly and each having a second surface facing in an inward direction of the assembly, the second surface of each of the first and second support elements respectively face one another, and the first and second support elements including at least one of: first terminals at the first surface of the first support element, or second terminals at the first surface of the second support element;
electrically conductive first elements at the second surface of the first support element;
a patterned layer of photo-imageable material overlying the second surface of the first support element;
electrically conductive masses of bonding material coupled to provide electrical conductivity to the electrically conductive first elements and extending through the patterned layer toward the second surface of the second support element;
a microelectronic element mounted to the second surface of one of the first and second support elements; and
electrically conductive second elements at the second surface of the second support element, the electrically conductive second elements electrically coupled with the electrically conductive masses and electrically coupled with the electrically conductive first elements through the electrically conductive masses.