US 9,812,432 B2
LED chip package
Yi-Jyun Chen, Chiayi County (TW); and Chih-Hao Lin, Taipei (TW)
Assigned to Lextar Electronics Corporation, Hsinchu (TW)
Filed by LEXTAR ELECTRONICS CORPORATION, Hsinchu (TW)
Filed on May 23, 2016, as Appl. No. 15/162,538.
Claims priority of application No. 104131094 A (TW), filed on Sep. 21, 2015.
Prior Publication US 2017/0084586 A1, Mar. 23, 2017
Int. Cl. H01L 25/075 (2006.01); H01L 33/08 (2010.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/50 (2010.01); H01L 27/15 (2006.01)
CPC H01L 25/0753 (2013.01) [H01L 25/0756 (2013.01); H01L 27/15 (2013.01); H01L 33/08 (2013.01); H01L 33/502 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An LED chip package, comprising:
a first substrate having a metal terminal; and
an LED chip set formed by a wafer level chip scale packaging, wherein the LED chip set comprises a second substrate having a plurality of electrically connected LED chips formed in one piece thereon and singulated so as to produce a plurality of light-emitting areas separate from each other, and the LED chip set is disposed on the first substrate and electrically connected to the metal terminal.