US 9,812,431 B2
Power semiconductor module
Tetsuya Inaba, Nagano (JP); and Yoshinari Ikeda, Nagano (JP)
Assigned to FUJI ELECTRIC CO., LTD., Kanagawa (JP)
Filed by Fuji Electric Co., Ltd., Kanagawa (JP)
Filed on Mar. 30, 2015, as Appl. No. 14/672,467.
Claims priority of application No. 2014-075640 (JP), filed on Apr. 1, 2014.
Prior Publication US 2015/0279753 A1, Oct. 1, 2015
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/07 (2006.01); H01L 23/049 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 23/24 (2006.01); H01L 23/373 (2006.01)
CPC H01L 25/072 (2013.01) [H01L 23/049 (2013.01); H01L 23/492 (2013.01); H01L 23/49811 (2013.01); H01L 23/24 (2013.01); H01L 23/3735 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A power semiconductor module, comprising:
a metal base;
a semiconductor element on the metal base, the semiconductor element having a first electrode on a bottom surface and a second electrode on a top surface thereof, said first electrode being electrically connected and fixed to said metal base;
a multilayer substrate on the metal base, placed side-by-side with the semiconductor element, the multilayer substrate being formed by stacking together a circuit plate, an insulating plate, and a metal plate, said metal plate being fixed to said metal base;
a circuit board that is provided so as to face said semiconductor element and said multilayer substrate and that has a metal film electrically connecting the second electrode of said semiconductor element to the circuit plate of said multilayer substrate; and
a conductive post electrically connected and fixed to the second electrode of said semiconductor element at one end and electrically connected and fixed to the metal film of said circuit board at another end,
wherein the circuit plate of said multilayer substrate and the metal film of the circuit board are connected via a solder that directly contacts the circuit plate and the metal film or via a solder and a metal block that are interposed between the circuit plate and the metal film.