US 9,812,430 B2
Package on-package method
Hsien-Wei Chen, Hsin-Chu (TW); An-Jhih Su, Taoyuan (TW); and Ying-Ju Chen, Tuku Township (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd, Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed on Oct. 24, 2016, as Appl. No. 15/332,489.
Application 15/332,489 is a division of application No. 14/496,948, filed on Sep. 25, 2014, granted, now 9,478,521.
Prior Publication US 2017/0040298 A1, Feb. 9, 2017
Int. Cl. H01L 23/52 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/81 (2013.01); H01L 25/0655 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/18 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81031 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06575 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3512 (2013.01); H01L 2924/35121 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
removing a portion of a dielectric layer of a bottom package to form a trench over a top surface of a metal structure;
dispersing an epoxy flux material in the trench to form an epoxy flux layer in the trench, wherein a top surface of the epoxy flux layer is higher than a top surface of the dielectric layer and a width of the metal structure is greater than a width of the trench;
mounting a top package on the bottom package, wherein a bottom surface of a solder ball of the top package is in contact with the top surface of the metal structure; and
performing a reflow process to form a joint structure, wherein:
the joint structure electrically connects the top package and the bottom package; and
the epoxy flux material fills a gap between the solder ball and the dielectric layer.