US 9,812,427 B2
Package on-package (PoP) structure including stud bulbs
Chen-Hua Yu, Hsin-Chu (TW); Mirng-Ji Lii, Sinpu Township (TW); Chung-Shi Liu, Hsin-Chu (TW); and Ming-Da Cheng, Jhubei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed on Oct. 7, 2016, as Appl. No. 15/288,751.
Application 15/288,751 is a continuation of application No. 14/548,093, filed on Nov. 19, 2014, granted, now 9,502,394.
Application 14/548,093 is a continuation of application No. 13/397,747, filed on Feb. 16, 2012, granted, now 8,912,651, issued on Dec. 16, 2014.
Claims priority of provisional application 61/565,280, filed on Nov. 30, 2011.
Prior Publication US 2017/0025391 A1, Jan. 26, 2017
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49894 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 24/94 (2013.01); H01L 25/50 (2013.01); H01L 25/105 (2013.01); H01L 2224/038 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05023 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05564 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/05693 (2013.01); H01L 2224/11019 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/1184 (2013.01); H01L 2224/11823 (2013.01); H01L 2224/11825 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13018 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/1358 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13562 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13639 (2013.01); H01L 2224/13644 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13664 (2013.01); H01L 2224/16057 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16503 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/48611 (2013.01); H01L 2224/48624 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/48647 (2013.01); H01L 2224/48655 (2013.01); H01L 2224/48664 (2013.01); H01L 2224/48693 (2013.01); H01L 2224/48711 (2013.01); H01L 2224/48724 (2013.01); H01L 2224/48744 (2013.01); H01L 2224/48764 (2013.01); H01L 2224/48793 (2013.01); H01L 2224/48811 (2013.01); H01L 2224/48824 (2013.01); H01L 2224/48844 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/48855 (2013.01); H01L 2224/48864 (2013.01); H01L 2224/48893 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81009 (2013.01); H01L 2224/81026 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a first pad on a first substrate;
a stud bulb on the first pad;
an elongated tail extending from the stud bulb;
a second pad on a second substrate; and
a solder connector on the second pad, the solder connector electrically coupled to the stud bulb, a height of the solder connector being less than a distance between the first pad and the second pad.