US 9,812,424 B2
Process of forming an electronic device including a ball bond
Harold G. Anderson, Chandler, AZ (US); and Cang Ngo, Mesa, AZ (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on May 2, 2016, as Appl. No. 15/143,797.
Claims priority of provisional application 62/269,251, filed on Dec. 18, 2015.
Prior Publication US 2017/0179074 A1, Jun. 22, 2017
Int. Cl. H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/311 (2006.01); H01L 23/495 (2006.01)
CPC H01L 24/85 (2013.01) [H01L 21/31111 (2013.01); H01L 23/49503 (2013.01); H01L 24/08 (2013.01); H01L 24/32 (2013.01); H01L 24/43 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/43847 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/4845 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85047 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85345 (2013.01); H01L 2224/85986 (2013.01); H01L 2924/20104 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A process of forming an electronic device comprising:
providing a wire comprising a first ball at an end thereof;
operating on the first ball to modify a surface of the first ball to form a modified surface;
moving the first ball to a first location on a die; and
bonding the first ball along the modified surface to the first location of the die,
wherein the modified surface comprises a pattern including a hatching, a concentric arcuate shape, a nonconcentric arcuate shape, a concentric polygonal shape, a nonconcentric polygonal shape, a zig-zag pattern, a dot matrix, a honeycomb, or any combination thereof.