US 9,812,420 B2
Die packaging with fully or partially fused dielectric leads
Sean S. Cahill, Santa Clara, CA (US); and Eric A. Sanjuan, Santa Clara, CA (US)
Assigned to ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG, Fridolfing (DE)
Appl. No. 14/902,504
Filed by ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG, Fridolfing (DE)
PCT Filed Jul. 2, 2014, PCT No. PCT/EP2014/001823
§ 371(c)(1), (2) Date Dec. 31, 2015,
PCT Pub. No. WO2015/000594, PCT Pub. Date Jan. 8, 2015.
Claims priority of provisional application 61/842,948, filed on Jul. 3, 2013.
Claims priority of provisional application 61/842,949, filed on Jul. 3, 2013.
Claims priority of provisional application 61/842,954, filed on Jul. 3, 2013.
Prior Publication US 2016/0379952 A1, Dec. 29, 2016
Int. Cl. H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 25/10 (2006.01); H01Q 23/00 (2006.01); H01L 23/367 (2006.01); H01Q 1/28 (2006.01); H01L 25/065 (2006.01)
CPC H01L 24/45 (2013.01) [H01L 23/367 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/97 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/105 (2013.01); H01Q 1/283 (2013.01); H01Q 23/00 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/4569 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48147 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85935 (2013.01); H01L 2224/85939 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06582 (2013.01); H01L 2225/06589 (2013.01); H01L 2225/1052 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3025 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An interconnect system, comprising
a first die having a plurality of connection pads, and
a ribbon lead having a plurality of metal cores with a core diameter, and a dielectric layer surrounding the metal core with a dielectric thickness, with at least a portion of dielectric being fused between adjacent metal cores along the length of the plurality of metal cores, and an outer metal layer attached to ground,
wherein the interconnect system is a multi-die interconnect system comprising the first die and a second die, with each die respectively having a plurality of connection pads, the ribbon lead extending from the first die to the second die.