US 9,812,419 B2
Semiconductor module having a conductor member for reducing thermal stress
Masakazu Tani, Tokyo (JP); and Yoshiyuki Deguchi, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Chiyoda-ku, Tokyo (JP)
Appl. No. 15/126,609
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Apr. 4, 2014, PCT No. PCT/JP2014/060009
§ 371(c)(1), (2) Date Sep. 16, 2016,
PCT Pub. No. WO2015/151285, PCT Pub. Date Oct. 8, 2015.
Prior Publication US 2017/0084568 A1, Mar. 23, 2017
Int. Cl. H01L 23/00 (2006.01); H01L 23/367 (2006.01)
CPC H01L 24/40 (2013.01) [H01L 23/3675 (2013.01); H01L 24/36 (2013.01); H01L 24/84 (2013.01); H01L 2224/40139 (2013.01); H01L 2224/40245 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A semiconductor module comprising a conducting member, wherein the conducting member electrically connects a semiconductor element arranged on a substrate or a bus bar with another electronic component and is provided with a structure having flexibility capable of, in a junction with the semiconductor element, reducing thermal stress due to difference in a coefficient of linear expansion between the conducting member and the semiconductor element, and absorbing dimensional error in objects to be connected,
wherein the semiconductor module further comprises a cooling surface structural part which is insulated from the semiconductor element and is installed on the substrate or the bus bar; and
wherein the conducting member is electrically connected to the semiconductor element and the other electronic component via the cooling surface structural part.