US 9,812,415 B2 | ||
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | ||
Matt E. Schwab, Boise, ID (US); David J. Corisis, Nampa, ID (US); and J. Michael Brooks, Caldwell, ID (US) | ||
Assigned to Micron Technology, Inc., Boise, ID (US) | ||
Filed by Micron Technology, Inc., Boise, ID (US) | ||
Filed on Oct. 3, 2014, as Appl. No. 14/506,423. | ||
Application 14/506,423 is a division of application No. 13/155,203, filed on Jun. 7, 2011, granted, now 8,866,272, issued on Oct. 21, 2014. | ||
Application 13/155,203 is a division of application No. 11/685,621, filed on Mar. 13, 2007, granted, now 7,955,898, issued on Jun. 7, 2011. | ||
Prior Publication US 2015/0021769 A1, Jan. 22, 2015 | ||
Int. Cl. H01L 21/44 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01) |
CPC H01L 24/03 (2013.01) [H01L 21/56 (2013.01); H01L 23/49811 (2013.01); H01L 24/06 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/28 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/11011 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/1405 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48235 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/85 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15184 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3511 (2013.01)] | 8 Claims |
1. A method for mounting a semiconductor device to a circuit board, the method comprising:
depositing a plurality of pre-formed solder balls on at least a portion of a device attach region of the circuit board;
juxtaposing a back side of the semiconductor device and the pre-formed solder balls;
forming a generally rigid connection between the back side of the semiconductor device and the circuit board by contacting
the pre-formed solder balls with a conductive layer and reflowing the pre-formed solder balls and conductive layer to form
a single, unitary connection structure, wherein the conductive layer covers all of the back side of the semiconductor device:
and
forming a plurality of wire bonds between terminals at a front side of the semiconductor device and corresponding contacts
on the circuit board after forming the generally rigid connection between the semiconductor device and the circuit board.
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