US 9,812,415 B2
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
Matt E. Schwab, Boise, ID (US); David J. Corisis, Nampa, ID (US); and J. Michael Brooks, Caldwell, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Oct. 3, 2014, as Appl. No. 14/506,423.
Application 14/506,423 is a division of application No. 13/155,203, filed on Jun. 7, 2011, granted, now 8,866,272, issued on Oct. 21, 2014.
Application 13/155,203 is a division of application No. 11/685,621, filed on Mar. 13, 2007, granted, now 7,955,898, issued on Jun. 7, 2011.
Prior Publication US 2015/0021769 A1, Jan. 22, 2015
Int. Cl. H01L 21/44 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01)
CPC H01L 24/03 (2013.01) [H01L 21/56 (2013.01); H01L 23/49811 (2013.01); H01L 24/06 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/28 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/11011 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/1405 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48235 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/85 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15184 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3511 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for mounting a semiconductor device to a circuit board, the method comprising:
depositing a plurality of pre-formed solder balls on at least a portion of a device attach region of the circuit board;
juxtaposing a back side of the semiconductor device and the pre-formed solder balls;
forming a generally rigid connection between the back side of the semiconductor device and the circuit board by contacting the pre-formed solder balls with a conductive layer and reflowing the pre-formed solder balls and conductive layer to form a single, unitary connection structure, wherein the conductive layer covers all of the back side of the semiconductor device: and
forming a plurality of wire bonds between terminals at a front side of the semiconductor device and corresponding contacts on the circuit board after forming the generally rigid connection between the semiconductor device and the circuit board.