US 9,812,413 B2
Chip module and method for forming the same
Ho-Yin Yiu, KLN (HK); Ying-Nan Wen, Hsinchu (TW); and Chien-Hung Liu, New Taipei (TW)
Assigned to XINTEC INC., Taoyuan (TW)
Filed by XINTEC INC., Taoyuan (TW)
Filed on Jan. 13, 2016, as Appl. No. 14/994,537.
Claims priority of provisional application 62/106,047, filed on Jan. 21, 2015.
Prior Publication US 2016/0211233 A1, Jul. 21, 2016
Int. Cl. H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 29/06 (2006.01)
CPC H01L 24/02 (2013.01) [H01L 23/3114 (2013.01); H01L 23/3135 (2013.01); H01L 24/94 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 29/0657 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02313 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/94 (2013.01); H01L 2924/00015 (2013.01); H01L 2924/0549 (2013.01); H01L 2924/10156 (2013.01); H01L 2924/15153 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A chip module, comprising:
a chip having an upper surface, a lower surface and a sidewall, wherein the chip comprises a signal pad region adjacent to the upper surface;
a recess extending from the upper surface toward the lower surface along the sidewall of the chip;
a redistribution layer electrically connected to the signal pad region and extending into the recess;
a circuit board between the upper surface and the lower surface and extending into the recess; and
a conducting structure in the recess and electrically connecting the circuit board to the redistribution layer.