US 9,812,406 B2
Microelectronic assemblies with cavities, and methods of fabrication
Hong Shen, Palo Alto, CA (US); Liang Wang, Milpitas, CA (US); Rajesh Katkar, San Jose, CA (US); Charles G. Woychik, San Jose, CA (US); and Guilian Gao, San Jose, CA (US)
Assigned to INVENSAS CORPORATION, San Jose, CA (US)
Filed by Invensas Corporation, San Jose, CA (US)
Filed on Sep. 29, 2016, as Appl. No. 15/280,175.
Application 15/280,175 is a continuation of application No. 14/745,237, filed on Jun. 19, 2015, granted, now 9,478,504.
Prior Publication US 2017/0018510 A1, Jan. 19, 2017
Int. Cl. H01L 23/12 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/053 (2006.01); H01L 23/29 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01); H01L 23/367 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 21/481 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/561 (2013.01); H01L 23/053 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5384 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 23/145 (2013.01); H01L 23/147 (2013.01); H01L 23/15 (2013.01); H01L 23/295 (2013.01); H01L 23/3675 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/92225 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/167 (2013.01); H01L 2924/1632 (2013.01); H01L 2924/16153 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/16315 (2013.01); H01L 2924/16787 (2013.01); H01L 2924/16788 (2013.01); H01L 2924/3511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An assembly comprising:
a first structure comprising a cavity; and
a second structure attached to the first structure and comprising a first microelectronic component and one or more second microelectronic components, wherein:
the first microelectronic component comprises a first substrate, the first microelectronic component comprising first circuitry, wherein the first substrate comprises a first side and one or more first holes in the first side;
each second microelectronic component comprises one or more respective second substrates, each second microelectronic component comprising respective second circuitry, each second microelectronic component being attached to the first side of the first substrate, wherein the second circuitry of each second microelectronic component is electrically coupled to the first circuitry;
wherein each second microelectronic component is located in the cavity and at least a portion of a sidewall of the cavity is located in a corresponding first hole such that at least a portion of a sidewall of the corresponding first hole extends laterally along a straight line adjacent to at least one second microelectronic component located in said cavity, and such that said at least a portion of a sidewall of the cavity extends laterally along the portion of the corresponding first hole.