US 9,812,402 B2
Wire bond wires for interference shielding
Abiola Awujoola, Pleasanton, CA (US); Zhuowen Sun, Campbell, CA (US); Wael Zohni, Campbell, CA (US); Ashok S. Prabhu, San Jose, CA (US); and Willmar Subido, San Jose, CA (US)
Assigned to Invensas Corporation, San Jose, CA (US)
Filed by Invensas Corporation, San Jose, CA (US)
Filed on Nov. 7, 2016, as Appl. No. 15/344,990.
Application 15/344,990 is a continuation of application No. 14/880,967, filed on Oct. 12, 2015, granted, now 9,490,222.
Prior Publication US 2017/0117231 A1, Apr. 27, 2017
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 23/49811 (2013.01); H01L 24/06 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/4942 (2013.01); H01L 2224/73207 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/3025 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for a microelectronic package having protection from interference, comprising:
a substrate having an upper surface and a lower surface opposite the upper surface and having a ground plane;
a microelectronic device coupled to the upper surface of the substrate;
wire bond wires having lower ends coupled to the ground plane, the wire bond wires extending away from the upper surface of the substrate;
the wire bond wires positioned to surround the microelectronic device to provide a shielding region for the microelectronic device with respect to the interference;
a conductive surface positioned above the wire bond wires for covering the shielding region; and
the wire bond wires having upper ends coupled to the conductive surface.