US 9,812,401 B2
Techniques for observing an entire communication bus in operation
Anne M. Mason, Palo Alto, CA (US); Peter J. Johnston, San Francisco, CA (US); Christine A. Laliberte, Portland, OR (US); Dominic P. McCarthy, Los Altos Hills, CA (US); Shawn X. Arnold, Santa Cruz, CA (US); and Souvik Mukherjee, Campbell, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Aug. 24, 2016, as Appl. No. 15/246,481.
Application 15/246,481 is a continuation of application No. 15/068,474, filed on Mar. 11, 2016, granted, now 9,763,329.
Prior Publication US 2017/0263561 A1, Sep. 14, 2017
Int. Cl. H05K 7/00 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01)
CPC H01L 23/5386 (2013.01) [H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 24/17 (2013.01); H01L 25/18 (2013.01); H05K 1/113 (2013.01); H05K 1/167 (2013.01); H05K 1/181 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/19043 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10378 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A routing apparatus, comprising:
a printed circuit board (PCB) having first and second arrays of contact pads;
an interposer having third, fourth and fifth arrays of contact pads, the third and fourth arrays of contact pads being disposed on opposing surfaces of the interposer, the third array of contact pads being electrically connected to the first array of contact pads;
a first integrated circuit mounted on the second array of contact pads;
a second integrated circuit mounted on the fourth array of contact pads,
wherein the interposer includes:
a first group of conductive traces insulated from one another;
a first array of conductive vias extending perpendicularly to the first group of conductive traces, the first array of conductive vias including through-vias connecting the third array of contact pads to corresponding contact pads in the fourth array of contact pads, the vias in the first array of conductive vias being arranged such that any two adjacent vias in a row of vias extending along any given dimension in the first array of conductive vias are equally spaced from each other; and
isolation resistors embedded within the first array of conductive vias such that each isolation resistor is disposed between at least two adjacent vias in the first array of conductive vias, each of the conductive traces in the first group of conductive traces being coupled to a different conductive via in the first array of conductive vias through one of the isolation resistors, and each isolation resistor being disposed closer to the conductive via to which the isolation resistor is coupled than all other conductive vias surrounding the isolation resistor, each isolation resistor being configured to produce a copy of a signal flowing through the conductive via that is coupled to one end of the isolation resistor on the conductive trace that is coupled to an opposite end of the isolation resistor.