US 9,812,385 B2
Electronic component package including electronic component, metal member, and sealing resin
Koji Kawakita, Nara (JP); Takashi Ichiryu, Osaka (JP); and Masanori Nomura, Osaka (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed on May 18, 2016, as Appl. No. 15/157,466.
Claims priority of application No. 2015-105759 (JP), filed on May 25, 2015.
Prior Publication US 2016/0351481 A1, Dec. 1, 2016
Int. Cl. H01L 23/49 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/433 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01)
CPC H01L 23/49582 (2013.01) [H01L 21/4821 (2013.01); H01L 23/4334 (2013.01); H01L 23/49558 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An electronic component package comprising:
a metal pattern layer having a first principal surface, and a second principal surface opposite to the first principal surface;
an electronic component that is disposed on the first principal surface, and electrically connected to the metal pattern layer;
at least one metal member that is disposed on the first principal surface, and electrically connected to the metal pattern layer;
a sealing resin layer disposed on the first principal surface, the electronic component, and the at least one metal member; and
an insulating layer disposed on the second principal surface,
wherein the at least one metal member has a thickness greater than a thickness of the electronic component,
wherein in plan view, the at least one metal member is disposed on an area of the first principal surface, the area including an end of the first principal surface,
wherein at least a part of the metal pattern layer is exposed from the insulating layer, the part located in an area below the at least one metal member, and
wherein an outermost side surface of the insulating layer is radially inward of an outermost side surface of the at least one metal member.