| US 9,812,384 B2 | ||
| Semiconductor device having compliant and crack-arresting interconnect structure | ||
| Gregory Thomas Ostrowicki, Rockwall, TX (US) | ||
| Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US) | ||
| Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US) | ||
| Filed on Nov. 15, 2016, as Appl. No. 15/352,393. | ||
| Application 15/352,393 is a continuation of application No. 15/053,453, filed on Feb. 25, 2016, granted, now 9,496,208. | ||
| Prior Publication US 2017/0250126 A1, Aug. 31, 2017 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01) | ||
| CPC H01L 23/49575 (2013.01) [H01L 23/49562 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 25/074 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/73213 (2013.01); H01L 2224/73263 (2013.01)] | 22 Claims |
| 1. A power converter comprising:
a first transistor chip that is coupled to and stacked on top of a second transistor chip; the second transistor chip having
a first surface that is coupled to a leadframe pad; and
a first metallic clip having a plate portion and a ridge portion that is bent at an angle from the plate portion to a lead;
the plate portion coupled to a first surface of the first transistor chip that is opposite to the second transistor chip;
the ridge portion configured as a plurality of parallel straight fingers with each finger discretely attached to the lead
and operable as a spring-line cantilever.
|