US 9,812,381 B1
Integrated fan-out package and method of fabricating the same
Chi-Hsi Wu, Hsinchu (TW); Chun-Yi Liu, Hsinchu (TW); Der-Chyang Yeh, Hsin-Chu (TW); Hsien-Wei Chen, Hsinchu (TW); Shih-Peng Tai, Hsinchu County (TW); and Chuen-De Wang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jul. 4, 2016, as Appl. No. 15/201,604.
Claims priority of provisional application 62/343,131, filed on May 31, 2016.
Int. Cl. H01L 21/00 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01)
CPC H01L 23/49527 (2013.01) [H01L 21/4821 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/3178 (2013.01); H01L 23/4952 (2013.01); H01L 23/49589 (2013.01); H01L 25/0655 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated fan-out package, comprising:
a first die and a second die arranged adjacent to the first die;
a molding compound encapsulating the first and second dies and separating the first die from the second die;
a redistribution structure disposed over the molding compound and on the first die and the second die, wherein the redistribution structure comprises:
a first connection structure electrically connected to the first die;
a second connection structure electrically connected to the second die; and
an inter-dielectric layer located between the first and second connection structures and separating the first connection structure from the second connection structure;
ball pads disposed on the redistribution structure, wherein the ball pads are electrically connected with the first die through the first connection structure or are electrically connected with the second die through the second connection structure; and
a bridge structure disposed on the first connection structure and on the second connection structure of the redistribution structure and electrically connecting the first die with the second die through the first connection structure and the second connection structure.