US 9,812,372 B2
Electrostatic chuck assembly, semiconductor manufacturing apparatus having the same, and method of measuring temperature of electrostatic chuck
Youn Sok Choi, Seoul (KR); Jeong Hyoun Sung, Suwon-si (KR); and Sang Yoon Soh, Yongin-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do (KR)
Filed on Aug. 9, 2016, as Appl. No. 15/232,151.
Claims priority of application No. 10-2015-0182154 (KR), filed on Dec. 18, 2015.
Prior Publication US 2017/0178978 A1, Jun. 22, 2017
Int. Cl. H01L 21/66 (2006.01); H01L 21/683 (2006.01)
CPC H01L 22/12 (2013.01) [H01L 21/6833 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electrostatic chuck assembly, comprising:
an electrostatic chuck to support a substrate using electrostatic force, the electrostatic chuck including a plurality of measurement zones divided by a plurality of partition lines;
a reference temperature sensor coupled to the electrostatic chuck to measure a reference temperature of the electrostatic chuck;
a measurement zone fiber-optic temperature sensor coupled to the electrostatic chuck and spaced from the reference temperature sensor, the measurement zone fiber-optic temperature sensor to sense measurement zone temperature signals of the measurement zones; and
a measurement zone temperature calculator to calculate a temperature of each of the measurement zones by setting a measurement range within a temperature range previously determined based on the reference temperature measured by the reference temperature sensor, and to measure the measurement zone temperature signal of each of the measurement zones sensed by the measurement zone fiber-optic temperature sensor within the measurement range.