US 9,812,347 B2
Semiconductor device and method
Sukianto Rusli, Phoenix, AZ (US)
Assigned to CHIP SOLUTIONS, LLC, Phoenix, AZ (US)
Filed by Chip Solutions, LLC, Phoenix, AZ (US)
Filed on Jul. 15, 2016, as Appl. No. 15/211,631.
Claims priority of provisional application 62/231,814, filed on Jul. 15, 2015.
Claims priority of provisional application 62/388,023, filed on Jan. 14, 2016.
Prior Publication US 2017/0018526 A1, Jan. 19, 2017
Int. Cl. H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC H01L 21/6835 (2013.01) [H01L 21/486 (2013.01); H01L 21/4846 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 24/82 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/0801 (2013.01); H01L 2224/08501 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/81455 (2013.01); H01L 2224/821 (2013.01); H01L 2224/82896 (2013.01); H01L 2924/15747 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a semiconductor die;
a substrate including a first surface and a second surface, the substrate comprising a conductive circuit and an insulative material over the conductive circuit, wherein the semiconductor die is attached to the second surface; and
an interconnect joint structure in the substrate creating a capture pad including a middle copper layer, an adjacent top nickel layer, and an adjacent bottom nickel layer.