US 9,812,346 B2
Semiconductor wafer device and manufacturing method thereof
Bor-Ping Jang, Hsin-Chu County (TW); Chien Ling Hwang, Hsinchu (TW); Hsin-Hung Liao, Taipei (TW); and Yeong-Jyh Lin, Nantou County (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on Dec. 14, 2015, as Appl. No. 14/968,573.
Application 14/968,573 is a division of application No. 14/049,898, filed on Oct. 9, 2013, granted, now 9,236,351.
Prior Publication US 2016/0099165 A1, Apr. 7, 2016
Int. Cl. H01L 21/46 (2006.01); H01L 21/683 (2006.01); H01L 23/544 (2006.01); H01L 21/78 (2006.01); B23K 26/364 (2014.01); B23K 26/40 (2014.01); B23K 26/402 (2014.01); B23K 103/00 (2006.01)
CPC H01L 21/6835 (2013.01) [B23K 26/364 (2015.10); B23K 26/40 (2013.01); B23K 26/402 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); B23K 2203/50 (2015.10); H01L 2221/68327 (2013.01); H01L 2924/0002 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a semiconductor device, comprising:
providing a carrier;
disposing a plurality of dies over the carrier along a direction to arrange the plurality of dies in a plurality of rows; and
shifting one of the plurality of rows along the direction in a predetermined distance; and
disposing an additional die at an end of the shifted one of the plurality of rows after the shifting.