US 9,812,344 B2
Wafer processing system with chuck assembly maintenance module
Jason Rye, Kalispell, MT (US); Mario David Silvetti, Morgan Hill, CA (US); Randy A. Harris, Kalispell, MT (US); Bryan Puch, Kalispell, MT (US); Vincent Steffan Francischetti, Columbia Falls, MT (US); and Satish Sundar, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by APPLIED Materials, Inc., Santa Clara, CA (US)
Filed on Feb. 3, 2015, as Appl. No. 14/613,081.
Prior Publication US 2016/0225656 A1, Aug. 4, 2016
Int. Cl. H01L 21/00 (2006.01); H01L 21/677 (2006.01); B08B 3/02 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67751 (2013.01) [B08B 3/02 (2013.01); H01L 21/68721 (2013.01); B08B 2203/0229 (2013.01)] 18 Claims
OG exemplary drawing
 
1. Apparatus comprising:
an enclosure;
a lift assembly within the enclosure, with the lift assembly including an upper rotor plate and a shaft attached to the upper rotor plate and rotated by a rotation motor, with an upper end of the shaft connected to a chuck clamp;
a lower rotor plate connected for rotation with the shaft; and
a lift motor connected to the lift assembly for lifting and lowering the lift assembly to move the upper rotor plate vertically relative to the lower rotor plate; and
a swing arm having one or more spray nozzles, with the swing arm movable from a first position above the lift assembly, to a second position off to one side of the lift assembly.