| US 9,812,344 B2 | ||
| Wafer processing system with chuck assembly maintenance module | ||
| Jason Rye, Kalispell, MT (US); Mario David Silvetti, Morgan Hill, CA (US); Randy A. Harris, Kalispell, MT (US); Bryan Puch, Kalispell, MT (US); Vincent Steffan Francischetti, Columbia Falls, MT (US); and Satish Sundar, San Jose, CA (US) | ||
| Assigned to Applied Materials, Inc., Santa Clara, CA (US) | ||
| Filed by APPLIED Materials, Inc., Santa Clara, CA (US) | ||
| Filed on Feb. 3, 2015, as Appl. No. 14/613,081. | ||
| Prior Publication US 2016/0225656 A1, Aug. 4, 2016 | ||
| Int. Cl. H01L 21/00 (2006.01); H01L 21/677 (2006.01); B08B 3/02 (2006.01); H01L 21/687 (2006.01) | ||
| CPC H01L 21/67751 (2013.01) [B08B 3/02 (2013.01); H01L 21/68721 (2013.01); B08B 2203/0229 (2013.01)] | 18 Claims |
| 1. Apparatus comprising:
an enclosure;
a lift assembly within the enclosure, with the lift assembly including an upper rotor plate and a shaft attached to the upper
rotor plate and rotated by a rotation motor, with an upper end of the shaft connected to a chuck clamp;
a lower rotor plate connected for rotation with the shaft; and
a lift motor connected to the lift assembly for lifting and lowering the lift assembly to move the upper rotor plate vertically
relative to the lower rotor plate; and
a swing arm having one or more spray nozzles, with the swing arm movable from a first position above the lift assembly, to
a second position off to one side of the lift assembly.
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