US 9,812,340 B2
Method of fabricating semiconductor package having semiconductor element
Chiang-Cheng Chang, Taichung (TW); Meng-Tsung Lee, Taichung (TW); Jung-Pang Huang, Taichung (TW); Shih-Kuang Chiu, Taichung (TW); and Fu-Tang Huang, Taichung (TW)
Assigned to Siliconware Precision Industries Co., Ltd., Taichung (TW)
Filed by Siliconware Precision Industries Co., Ltd., Taichung (TW)
Filed on Mar. 18, 2016, as Appl. No. 15/74,110.
Application 15/074,110 is a division of application No. 13/654,754, filed on Oct. 18, 2012, granted, now 9,324,585.
Claims priority of application No. 101125979 A (TW), filed on Jul. 19, 2012.
Prior Publication US 2016/0196990 A1, Jul. 7, 2016
Int. Cl. H01L 21/00 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01)
CPC H01L 21/568 (2013.01) [H01L 21/561 (2013.01); H01L 21/6835 (2013.01); H01L 21/76802 (2013.01); H01L 21/76834 (2013.01); H01L 21/76877 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 23/3128 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/24153 (2013.01); H01L 2924/00014 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method of fabricating a semiconductor package, comprising:
providing a carrier having at least a semiconductor element disposed on a surface thereof, wherein the semiconductor element has opposite first and second surfaces, and the first surface of the semiconductor element is attached to the carrier through an adhesive layer in a manner that a portion of the surface of the carrier is exposed from the adhesive layer;
forming a polymer layer on the exposed surfaces of the carrier and the second surface of the semiconductor element;
forming an encapsulant on the carrier to encapsulate the polymer layer and the semiconductor element, wherein the encapsulant has opposite top and bottom surfaces and the bottom surface of the encapsulant is in contact with the polymer layer;
removing the adhesive layer and the carrier such that the first surface of the semiconductor element is exposed from the bottom surface of the encapsulant, and the first surface of the semiconductor element is on a lower level than the bottom surface of the encapsulant, wherein the polymer layer is formed between the semiconductor element and the encapsulant, the polymer layer extends onto the bottom surface of the encapsulant, the polymer layer is free from being formed on the first surface of the semiconductor element, and the first surface of the semiconductor element and the polymer layer form a step structure; and
forming a build-up structure on the exposed surface of the semiconductor element and on the polymer layer on the bottom surface of the encapsulant.