US 9,812,339 B1
Method of assembling semiconductor devices of varying thicknesses
Pimpa Boonyatee, Bangkok (TH); Pitak Seantumpol, Bangkok (TH); and Paradee Jitrungruang, Bangkok (TH)
Assigned to NXP B.V., San Jose, CA (US)
Filed by NXP B.V., Eindhoven (NL)
Filed on Apr. 24, 2017, as Appl. No. 15/495,915.
Int. Cl. H01L 21/56 (2006.01); H01L 23/28 (2006.01); H01L 21/78 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 21/561 (2013.01) [H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/78 (2013.01); H01L 23/3121 (2013.01); H01L 23/49513 (2013.01); H01L 24/13 (2013.01); H01L 24/48 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/182 (2013.01); H01L 2924/1815 (2013.01)] 14 Claims
OG exemplary drawing
1. A method of packaging a semiconductor die, comprising:
mounting the semiconductor die on a carrier;
electrically connecting electrical contact pads of the semiconductor die to external electrical contacts;
encapsulating the semiconductor die with a mold compound to form a packaged die; and
thinning the mold compound on a top, non-active side of the packaged die using a saw blade,
wherein the carrier comprises a lead frame and the semiconductor die is mounted on a die pad of the lead frame and attached thereto with a die attach material, the external electrical contacts comprise lead fingers of the lead frame, and the die electrical contact pads are electrically connected to the lead fingers with bond wires.