|1. A tungsten sintered compact sputtering target consisting of tungsten, impurities excluding gas components, and gas components
consisting of oxygen, carbon, hydrogen, nitrogen and sulfur, wherein the sputtering target has a sintered structure such that
an average content of iron as an impurity in the sintered structure is in an amount of 0.4 to 0.8 wtppm, a content of iron
varies from location to location within the sputtering target by an amount of ±0.1 wtppm about the average content of iron,
and the sputtering target has a relative density of 99% or higher, an average crystal grain size of about 20-50 μm, a crystal
grain size ranging from 5 to 200 pm, a concentration of impurities in total excluding gas components of about 1.001-1.013
wtppm, and a content for each of oxygen, carbon, hydrogen, nitrogen and sulfur of 50 wtppm or less, wherein oxygen and carbon
are each between about 20-30 wtppm.