US 9,812,299 B2
Apparatus and method for pretreating and coating bodies
Rainer Cremer, Monschau (DE); and Walter May, Aachen (DE)
Assigned to CemeCon AG, Würselen (DE)
Appl. No. 12/989,882
Filed by Rainer Cremer, Monschau (DE); and Walter May, Aachen (DE)
PCT Filed Apr. 28, 2009, PCT No. PCT/EP2009/003082
§ 371(c)(1), (2), (4) Date Jan. 6, 2011,
PCT Pub. No. WO2009/132822, PCT Pub. Date Nov. 5, 2009.
Claims priority of application No. 10 2008 021 128 (DE), filed on Apr. 28, 2008.
Prior Publication US 2011/0180389 A1, Jul. 28, 2011
Int. Cl. C23C 14/14 (2006.01); H01J 37/34 (2006.01); C23C 14/35 (2006.01)
CPC H01J 37/3408 (2013.01) [C23C 14/14 (2013.01); C23C 14/352 (2013.01); H01J 37/3444 (2013.01); H01J 37/3467 (2013.01); H01J 37/3473 (2013.01)] 14 Claims
OG exemplary drawing
1. An apparatus for pretreating and coating of bodies by magnetron sputtering, comprising:
a vacuum chamber with a metallic chamber wall and at least one magnetron arranged therein having at least one sputter target,
wherein said magnetron is provided as a high power pulsed magnetron sputtering (HPPMS) magnetron for operation according to the high power pulsed magnetron sputtering process,
wherein at least one electrical conductor feeds electric pulses to the HPPMS magnetron by connecting a capacitor bank of parallel connected capacitors to the sputter target of the HPPMS magnetron by means of a switching element, and
wherein the switching element and the capacitor bank are arranged directly on the chamber wall, and
wherein a direct current power supply is connected to charge the capacitors of the capacitor bank, said direct current power supply being arranged remote from said chamber wall.