US 9,812,290 B2
Microscopy imaging method and system
Michael William Phaneuf, Ottawa (CA); and Ken Guillaume Lagarec, Ottawa (CA)
Assigned to FIBICS INCORPORATED, Ottawa (CA)
Filed by Fibics Incorporated, Ottawa (CA)
Filed on Jan. 31, 2017, as Appl. No. 15/420,844.
Application 15/420,844 is a continuation of application No. 14/117,256, granted, now 9,633,819, previously published as PCT/CA2012/050316, filed on May 14, 2012.
Claims priority of provisional application 61/485,713, filed on May 13, 2011.
Prior Publication US 2017/0140897 A1, May 18, 2017
This patent is subject to a terminal disclaimer.
Int. Cl. H01J 37/304 (2006.01); H01J 37/305 (2006.01)
CPC H01J 37/3056 (2013.01) [H01J 37/304 (2013.01); H01J 2237/3174 (2013.01); H01J 2237/31749 (2013.01)] 19 Claims
OG exemplary drawing
1. A method for cross-sectioning a sample with a preset thickness, comprising:
providing a sample having x, y and z dimensions with at least first and second line structures on a surface of the sample defined by the z-x plane, the at least first and second line structures each extending from the x-y plane at known angles and having ends electronically detectable on a first from a cross-section surface of the sample defined by the x-y plane;
exposing a second cross-section surface defined by the x-y plane with a material removal tool, where an x dimension distance between ends of the at least first and second line structures exposed in each cross-sectioned surface changes along the z-dimension;
electronically calculating a first distance in the z-dimension between the first cross-section surface and the second cross-section surface based on a change in the x dimension distance and the angles; automatically adjusting parameters to advance the material removal tool in the z dimension for exposing a third cross-section surface at a second distance in the z dimension from the second cross-section surface that is closer to the preset thickness than the first distance.