US 9,812,284 B2
Charged particle beam drawing apparatus and charged particle beam drawing method
Hideki Matsui, Yokohama (JP)
Assigned to NuFlare Technology, Inc., Yokohama-shi (JP)
Filed by NUFLARE TECHNOLOGY, INC., Yokohama-shi (JP)
Filed on Mar. 15, 2016, as Appl. No. 15/70,679.
Claims priority of application No. 2015-101953 (JP), filed on May 19, 2015.
Prior Publication US 2016/0343535 A1, Nov. 24, 2016
This patent is subject to a terminal disclaimer.
Int. Cl. H01J 37/147 (2006.01); H01J 37/317 (2006.01)
CPC H01J 37/1472 (2013.01) [H01J 37/3174 (2013.01); H01J 2237/043 (2013.01); H01J 2237/103 (2013.01); H01J 2237/2485 (2013.01); H01J 2237/3175 (2013.01)] 10 Claims
OG exemplary drawing
1. A charged particle beam drawing apparatus for deflecting a charged particle beam with a deflector to draw a pattern, the charged particle beam drawing apparatus comprising:
a storage unit that stores an approximate formula indicating a correspondence relationship between a settling time for a DAC (digital/analog converter) amplifier that controls the deflector, and a position shift amount, from a design position, of a drawn position of each evaluation pattern drawn on a first substrate while the settling time and an amount of deflection of the charged particle beam by the deflector are changed;
a shot data generation unit that converts drawing data to shot data configured with a shot of the charged particle beam as a unit;
a shot position correction unit that creates a correction formula indicating a relationship between an amount of deflection and a shot position shift amount at the settling time, from the approximate formula and the settling time for the DAC amplifier based on an amount of deflection of a shot obtained from the shot data, obtains a position correction amount by using the amount of deflection of the shot and the correction formula, and corrects a shot position defined by the shot data on the basis of the position correction amount; and
a drawing unit that performs drawing by applying the charged particle beam onto a second substrate by using the shot data with a corrected shot position.