US 9,812,262 B2
Multilayer ceramic capacitor
Hiroaki Sugita, Nagaokakyo (JP); and Shota Kitano, Nagaokakyo (JP)
Assigned to Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu (JP)
Filed on Mar. 28, 2017, as Appl. No. 15/470,947.
Application 15/470,947 is a continuation of application No. 14/822,916, filed on Aug. 11, 2015, granted, now 9,640,323.
Claims priority of application No. 2014-164842 (JP), filed on Aug. 13, 2014.
Prior Publication US 2017/0200558 A1, Jul. 13, 2017
Int. Cl. H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/228 (2006.01); H01G 4/38 (2006.01); H05K 1/18 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/1218 (2013.01); H01G 4/228 (2013.01); H01G 4/38 (2013.01); H05K 1/18 (2013.01); H05K 2201/10015 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A multilayer ceramic capacitor comprising:
a multilayer body including a plurality of dielectric layers and a plurality of conductive layers, which are stacked therein in a stacking direction, and including a first principle surface and a second principle surface that are opposite to each other in the stacking direction, a first end surface and a second end surface that are opposite to each other in a length direction and connect the first principle surface and the second principle surface, and a first side surface and a second side surface that are opposite to each other in a width direction and connect the first principle surface and the second principle surface as well as the first end surface and the second end surface; and
first and second outer electrodes provided on portions of a surface of the multilayer body and electrically connected to at least one of the plurality of conductive layers; wherein
the multilayer body includes a first outer layer portion which includes a first of the plurality of dielectric layers closest to the first principle surface, a second outer layer portion which includes a second of the plurality of dielectric layers closest to the second principle surface, and an inner layer portion adjacent to both of the first outer layer portion and the second outer layer portion, the inner layer portion including a portion extending from a first of the plurality of conductive layers closest to the first principle surface to a second of the plurality of conductive layers closest to the second principle surface in the stacking direction;
a dimension of the inner layer portion in the stacking direction is greater than a dimension of the inner layer portion in the width direction;
the second outer layer portion includes an outer portion including the second principle surface, and an inner portion disposed adjacent to both of the outer portion and the inner layer portion; and
a composition ratio of Si relative to Ti in the outer portion is about 0.004 higher than that in the inner portion.