US 9,812,259 B2
Multilayer ceramic capacitor, method of manufacturing the same, and board having the same
Seung Ho Lee, Suwon-Si (KR); Jong Han Kim, Suwon-Si (KR); and Min Gon Lee, Suwon-Si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-Si, Gyeonggi-Do (KR)
Filed on Oct. 16, 2014, as Appl. No. 14/516,435.
Claims priority of application No. 10-2014-0064329 (KR), filed on May 28, 2014.
Prior Publication US 2015/0348712 A1, Dec. 3, 2015
Int. Cl. H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/248 (2006.01); H01G 2/06 (2006.01); H05K 3/34 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/1227 (2013.01); H01G 4/248 (2013.01); H01G 2/06 (2013.01); H05K 3/3442 (2013.01); H05K 2201/10015 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A multilayer ceramic capacitor, comprising:
an active part including dielectric layers and internal electrodes which are alternately stacked therein in a stacking direction; and
cover parts disposed on an upper surface and a lower surface of the active part, respectively,
wherein each of the cover parts includes an active part protective cover and an exterior cover, each of the active part protective covers being disposed adjacent to the active part and each of the exterior covers extending in the stacking direction to an external surface of the multilayer ceramic capacitor,
wherein a porosity of each of the exterior covers is higher than a porosity of each of the active part protective covers, respectively, and
wherein the porosity of at least one of the exterior covers is about 12 vol % to 43 vol %.