US 9,812,203 B2 | ||
Semiconductor memory having both volatile and non-volatile functionality including resistance change material and method of operating | ||
Yuniarto Widjaja, San Jose, CA (US) | ||
Assigned to Zeno Semiconductor, Inc., Sunnyvale, CA (US) | ||
Filed by Zeno Semiconductor, Inc., Sunnyvale, CA (US) | ||
Filed on Oct. 12, 2016, as Appl. No. 15/292,098. | ||
Application 14/738,349 is a division of application No. 13/244,812, filed on Sep. 26, 2011, granted, now 9,087,580, issued on Jul. 21, 2015. | ||
Application 15/292,098 is a continuation of application No. 14/738,349, filed on Jun. 12, 2015, granted, now 9,490,012. | ||
Application 13/244,812 is a continuation of application No. 12/545,623, filed on Aug. 21, 2009, granted, now 8,159,868, issued on Apr. 17, 2012. | ||
Claims priority of provisional application 61/091,071, filed on Aug. 22, 2008. | ||
Prior Publication US 2017/0032842 A1, Feb. 2, 2017 | ||
This patent is subject to a terminal disclaimer. | ||
Int. Cl. G11C 14/00 (2006.01); G11C 11/14 (2006.01); G11C 11/404 (2006.01); G11C 11/56 (2006.01); G11C 13/00 (2006.01); H01L 27/108 (2006.01); H01L 27/24 (2006.01); H01L 29/78 (2006.01); H01L 27/102 (2006.01); H01L 45/00 (2006.01); G06F 3/06 (2006.01) |
CPC G11C 14/0045 (2013.01) [G06F 3/0619 (2013.01); G06F 3/0647 (2013.01); G06F 3/0685 (2013.01); G11C 11/14 (2013.01); G11C 11/404 (2013.01); G11C 11/5678 (2013.01); G11C 11/5685 (2013.01); G11C 13/0004 (2013.01); G11C 13/0007 (2013.01); G11C 13/0033 (2013.01); H01L 27/108 (2013.01); H01L 27/1023 (2013.01); H01L 27/10802 (2013.01); H01L 27/10897 (2013.01); H01L 27/24 (2013.01); H01L 27/2445 (2013.01); H01L 27/2463 (2013.01); H01L 29/7841 (2013.01); H01L 45/06 (2013.01); H01L 45/065 (2013.01); H01L 45/085 (2013.01); H01L 45/1233 (2013.01); H01L 45/1253 (2013.01); H01L 45/141 (2013.01); H01L 45/146 (2013.01); H01L 45/147 (2013.01); G11C 2013/0045 (2013.01); G11C 2013/0078 (2013.01); G11C 2211/4016 (2013.01); G11C 2211/5643 (2013.01); G11C 2213/31 (2013.01); G11C 2213/32 (2013.01)] | 21 Claims |
1. A semiconductor memory cell comprising:
a silicon controlled rectifier device comprising a floating body having a first conductivity type selected from n-type conductivity
type and p-type conductivity type and configured to store data when power is applied to said cell;
a nonvolatile memory comprising a resistance change element configured to store data stored in said silicon controlled rectifier
device upon transfer thereto;
a buried layer region having a second conductivity type selected from said n-type conductivity type and said p-type conductivity
type and being different from said first conductivity type.
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