| US 9,812,158 B1 | ||
| Bond pad sharing for powering a multiplicity of electrical components of a recording head | ||
| Narayanan Ramakrishnan, Eden Prairie, MN (US); and Declan Macken, Eden Prairie, MN (US) | ||
| Assigned to SEAGATE TECHNOLOGY LLC, Cupertino, CA (US) | ||
| Filed by Seagate Technology LLC, Cupertino, CA (US) | ||
| Filed on Dec. 6, 2016, as Appl. No. 15/370,985. | ||
| Claims priority of provisional application 62/268,037, filed on Dec. 16, 2015. | ||
| Int. Cl. G11B 5/48 (2006.01); G11B 5/00 (2006.01) | ||
| CPC G11B 5/4853 (2013.01) [G11B 2005/0021 (2013.01)] | 20 Claims |
| 1. An apparatus, comprising:
a slider of a magnetic recording head comprising a plurality of electrical bond pads coupled to bias sources and a ground
pad;
a plurality of electrical components of the slider each coupled one or more of the electrical bond pads, wherein at least
one of the electrical bond pads is a shared electrical bond pad coupled to at least a first electrical component and a second
electrical component; and
a switching transistor coupled to the first and second components and the ground pad, the switching transistor arranged to
control powering of the second component in response to biasing of the first component.
|