US 9,812,111 B1
Sound insulation panels having high interlayer thickness factors
Jun Lu, East Longmeadow, MA (US)
Assigned to Solutia Inc., St. Louis, MO (US)
Filed by SOLUTIA INC., St. Louis, MO (US)
Filed on Oct. 19, 2016, as Appl. No. 15/297,874.
Int. Cl. G10K 11/168 (2006.01); B32B 17/10 (2006.01); B32B 17/06 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 7/02 (2006.01); G10K 11/16 (2006.01); B32B 17/00 (2006.01)
CPC G10K 11/168 (2013.01) [B32B 7/02 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 2307/102 (2013.01)] 20 Claims
OG exemplary drawing
1. A sound insulating multiple layer panel comprising:
a first rigid substrate having a first thickness H3,
a second rigid substrate having a second thickness H1, wherein H3≤H1,
and a multiple layer acoustic interlayer having a thickness H2 between the first and second rigid substrates, wherein the multiple layer interlayer comprises a first stiff layer having a stiff layer thickness, a second stiff layer having a second stiff layer thickness, and a soft layer between the first and second stiff layers,
and wherein the multiple layer panel has an interlayer thickness factor, If, of at least 0.80, wherein If=(H2−0.84)÷[(H1+H3)(H1+H2+H3)]×100.