US 9,811,896 B2
Measuring apparatus
Ikunao Isomura, Kanagawa (JP); and Nobutaka Kikuiri, Kanagawa (JP)
Assigned to NuFlare Technology, Inc., Yokohama (JP)
Filed by NuFlare Technology, Inc., Yokohama (JP)
Filed on Oct. 31, 2014, as Appl. No. 14/529,297.
Claims priority of application No. 2013-230592 (JP), filed on Nov. 6, 2013.
Prior Publication US 2015/0125066 A1, May 7, 2015
Int. Cl. G06K 9/00 (2006.01); G06T 7/00 (2017.01)
CPC G06T 7/001 (2013.01) [G06T 2207/10016 (2013.01); G06T 2207/20021 (2013.01); G06T 2207/30148 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A measuring apparatus comprising:
an input unit configured by a circuit, to receive optical image data of a figure pattern, formed on an exposure photo mask used for transferring a pattern to a wafer, obtained by a pattern inspection apparatus, which inspects a defect of a pattern formed on the exposure photo mask to be inspected by scanning an inspection region of the exposure photo mask to be inspected, from the pattern inspection apparatus, and to receive reference image data generated from design data of the pattern by the pattern inspection apparatus in order to be compared with the optical image data, from the pattern inspection apparatus;
a positional deviation distribution generation unit configured by the circuit, to generate positional deviation distribution by measuring a positional deviation amount of the pattern on the exposure photo mask to be inspected, by using the optical image data, the reference image data and position data of the optical image data obtained by the pattern inspection apparatus; and
an output unit configured by the circuit, to output generated positional deviation distribution of the pattern on the exposure photo mask to be inspected, wherein
the inspection region of the exposure photo mask to be inspected is virtually divided into a plurality of stripe regions each being strip-shaped, in a direction orthogonal to a scanning direction scanned by the pattern inspection apparatus,
the measuring apparatus is arranged independently from the pattern inspection apparatus,
the input unit is further configured to receive the position data of the optical image data obtained by the pattern inspection apparatus while the optical image data is obtained by the pattern inspection apparatus,
the optical image data corresponds to sequentially scanned stripe regions of the plurality of adjacent stripe regions, virtually divided in the direction orthogonal to the scanning direction scanned by the pattern inspection apparatus, and
the measuring apparatus including the input unit, the positional deviation distribution generation unit, and the output unit is arranged in an enclosure different from that used for the pattern inspection apparatus which performs all of scanning the inspection region of the exposure photo mask, obtaining the optical image data of the exposure photo mask, generating the reference image data in order to be compared with the optical image data, generating position data of the optical image data, and inspecting the defect of the pattern formed on the exposure photo mask.