US 9,811,709 B2
Capacitor sensor structure, circuit board structure with capacitor sensor, and package structure of capacitive sensor
Ming-Chung Chang, Hsinchu County (TW); and Tzu Wei Liu, Hsinchu County (TW)
Assigned to MSTAR SEMICONDUCTOR, INC., Hsinchu Hsien (TW)
Filed by MStar Semiconductor, Inc., Hsinchu Hsien (TW)
Filed on Jun. 27, 2016, as Appl. No. 15/193,585.
Claims priority of application No. 104122620 A (TW), filed on Jul. 13, 2015.
Prior Publication US 2017/0017823 A1, Jan. 19, 2017
Int. Cl. H01L 23/495 (2006.01); G06K 9/00 (2006.01); H01L 23/498 (2006.01); H01L 23/16 (2006.01)
CPC G06K 9/0002 (2013.01) [H01L 23/4985 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48235 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/157 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A capacitive fingerprint sensor structure, comprising:
a substrate;
a semiconductor chip, comprising a fingerprint sensing controller circuit; and
a redistribution layer (RDL), disposed on said substrate and electrically connected to said semiconductor chip, comprising:
a first wire, longer than an orthographic projection of said semiconductor chip;
a second wire, longer than said orthographic projection; and
a dielectric material, disposed between said first wire and said second wire,
wherein said RDL is a passive capacitance sensing circuit used by said fingerprint sensing controller circuit.