US 9,811,693 B2
Wiring board and method for recognizing code information thereof
Takafumi Kawashima, Kyoto (JP)
Assigned to KYOCERA CORPORATION, Kyoto-shi, Kyoto (JP)
Filed by KYOCERA Circuit Solutions, Inc., Kyoto (JP)
Filed on Feb. 1, 2016, as Appl. No. 15/11,823.
Claims priority of application No. 2015-018976 (JP), filed on Feb. 3, 2015.
Prior Publication US 2016/0224811 A1, Aug. 4, 2016
Int. Cl. G06K 7/06 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC G06K 7/065 (2013.01) [H05K 1/0268 (2013.01); H05K 1/0298 (2013.01); H05K 1/111 (2013.01); H05K 1/113 (2013.01); H05K 1/181 (2013.01); H01L 2224/16225 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10734 (2013.01)] 10 Claims
OG exemplary drawing
1. A wiring board comprising:
an insulating board comprising a core insulating plate and an insulating layer laminated on at least one surface of the insulating plate,
wherein a plurality of code information reading pads formed of a conductor layer having an inherent code information are disposed on a surface of the insulating layer formed uppermost,
wherein a common conductor is disposed oppositely to the code information reading pads by interposing therebetween the insulating layer formed uppermost, and
wherein at least one of the code information reading pads and the common conductor are electrically connected to each other through a via conductor penetrating through the insulating layer formed uppermost.