US 9,811,491 B2
Minimizing thermal impacts of local-access PCI devices
Michael DeCesaris, Carrboro, NC (US); Luke D. Remis, Raleigh, NC (US); Brian C. Totten, Durham, NC (US); and John K. Whetzel, Holly Springs, NC (US)
Assigned to Lenovo Enterprise Solutions (Singapore) Pte. Ltd., Singapore (SG)
Filed by Lenovo Enterprise Solutions (Singapore) Pte. Ltd., Singapore (SG)
Filed on Apr. 7, 2015, as Appl. No. 14/680,724.
Prior Publication US 2016/0299864 A1, Oct. 13, 2016
Int. Cl. G06F 3/00 (2006.01); G06F 13/40 (2006.01); G06F 13/42 (2006.01)
CPC G06F 13/4027 (2013.01) [G06F 13/4221 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method, comprising:
performing operations on a compute node including a plurality of processors, each processor having a local PCI processing element and a local processor interconnect, wherein the local processor interconnect of each processor is connected to the local processor interconnect of at least one other processor;
identifying a PCI device that is directly attached to the local PCI processing element of a first one of the processors and positioned in an upstream airflow direction from the first processor;
an operating system monitoring operation of the PCI device and identifying a power-intensive task that the PCI device is performing; and
in response to identifying the power intensive task that the PCI device is performing, the operating system directing the identified power-intensive task away from the first processor to be handled by a second one of the processors, wherein the local processor interconnect of the second processor is directly connected to the processor interconnect of the first processor.