US 9,811,230 B2
Touch panel and production method thereof
Kenji Matsumoto, Tokyo (JP); Tsutomu Ohgushi, Tokyo (JP); Tsuyoshi Takiguchi, Tokyo (JP); and Joji Akizuki, Tokyo (JP)
Assigned to Japan Aviation Electronics Industry, Limited, Tokyo (JP)
Filed by Japan Aviation Electronics Industry, Limited, Tokyo (JP)
Filed on May 18, 2015, as Appl. No. 14/715,055.
Claims priority of application No. 2014-108165 (JP), filed on May 26, 2014.
Prior Publication US 2015/0338977 A1, Nov. 26, 2015
Int. Cl. G06F 3/047 (2006.01); G06F 3/044 (2006.01)
CPC G06F 3/047 (2013.01) [G06F 3/044 (2013.01); G06F 2203/04103 (2013.01); Y10T 29/49163 (2015.01)] 13 Claims
OG exemplary drawing
 
1. A touch panel comprising:
a transparent substrate;
one or more sensor electrode portions formed on a surface of the transparent substrate; and
one or more lead-out wiring portions formed around the sensor electrode portion on the surface of the transparent substrate and connected to the sensor electrode portion,
wherein the sensor electrode portion includes:
a plurality of first sensor electrode arrays in each of which a plurality of first island-shaped electrode portions are arrayed along a first direction and connected through connecting portions, the plurality of first sensor electrode arrays being arranged parallel to one another along a second direction that crosses the first direction;
a plurality of second sensor electrode arrays in each of which a plurality of second island-shaped electrode portions are arrayed at intervals along the second direction, the plurality of second sensor electrode arrays being arranged parallel to one another along the first direction; and
a plurality of jumper wiring portions which are arranged such that the plurality of jumper wiring portions and the corresponding connecting portions are superimposed through insulating portions, the plurality of jumper wiring portions electrically connecting the second island-shaped electrode portions arranged adjacent to each other along the second direction,
wherein the lead-out wiring portion includes:
a plurality of first wiring portions connected to the plurality of first sensor electrode arrays of the sensor electrode portion, respectively; and
a plurality of second wiring portions connected to the plurality of second sensor electrode arrays of the sensor electrode portion, respectively,
wherein the plurality of first sensor electrode arrays and the plurality of second sensor electrode arrays of the sensor electrode portion are formed of a first transparent conductor layer having a first thickness,
wherein the plurality of jumper wiring portions of the sensor electrode portion are formed of a second transparent conductor layer having a second thickness, and
wherein the lead-out wiring portion is formed of a third transparent conductor layer having a two-layer structure in which a first lead-out wiring layer of the second thickness having a predetermined pattern shape and a second lead-out wiring layer of the first thickness having the predetermined pattern shape are in contact with each other and superimposed on each other.