US 9,811,226 B2
Sensor device, input device, and electronic apparatus
Takashi Itaya, Kanagawa (JP); Shogo Shinkai, Kanagawa (JP); Hiroto Kawaguchi, Kanagawa (JP); Fumihiko Iida, Kanagawa (JP); Hayato Hasegawa, Kanagawa (JP); Kei Tsukamoto, Kanagawa (JP); Takayuki Tanaka, Kanagawa (JP); Tomoko Katsuhara, Kanagawa (JP); Tomoaki Suzuki, Kanagawa (JP); Taizo Nishimura, Kanagawa (JP); Hiroshi Mizuno, Kanagawa (JP); and Yasuyuki Abe, Kanagawa (JP)
Assigned to Sony Corporation, Tokyo (JP)
Appl. No. 14/914,405
Filed by Sony Corporation, Tokyo (JP)
PCT Filed Aug. 22, 2014, PCT No. PCT/JP2014/004330
§ 371(c)(1), (2) Date Feb. 25, 2016,
PCT Pub. No. WO2015/037197, PCT Pub. Date Mar. 19, 2015.
Claims priority of application No. 2013-187049 (JP), filed on Sep. 10, 2013.
Prior Publication US 2016/0202800 A1, Jul. 14, 2016
Int. Cl. G06F 3/044 (2006.01); G06F 3/0488 (2013.01); G06F 3/041 (2006.01); G06F 3/047 (2006.01)
CPC G06F 3/044 (2013.01) [G06F 3/047 (2013.01); G06F 3/0414 (2013.01); G06F 2203/04102 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A sensor device comprising:
a sheet-like first conductor layer;
an electrode substrate including
a plurality of first electrode wires,
a plurality of second electrode wires, capacity sensors being formed at paired portions of the first and second electrode wires, and
a sheet substrate that supports the first and second electrode wires; and
a first supporting body including a plurality of first structures that connect the first conductor layer and the electrode substrate;
wherein the sheet substrate includes:
a main body that supports the plurality of first electrode wires and the plurality of second electrode wires, and
a projecting portion, having a first surface and a second surface, that is integrally formed with and provided on an edge portion of the main body, that projects outward from the edge portion, and that supports a plurality of first lead wires on the first surface and a plurality of second lead wires on the second surface, the plurality of first lead wires and the plurality of second lead wires being connected to the plurality of first electrode wires and the plurality of second electrode wires, respectively.