| US 9,811,222 B2 | ||
| Sensing structure | ||
| Bao-Shun Yau, Kaohsiung (TW); Sheng-Feng Chung, Hsinchu (TW); Su-Tsai Lu, Hsinchu (TW); Yu-Ling Hsieh, Hsinchu (TW); Cheng-Yi Shih, Hsinchu (TW); Shu-Yi Chang, Kaohsiung (TW); Kuo-Hua Tseng, New Taipei (TW); and Heng-Tien Lin, Hsinchu County (TW) | ||
| Assigned to Industrial Technology Research Institute, Hsinchu (TW) | ||
| Filed by Industrial Technology Research Institute, Hsinchu (TW) | ||
| Filed on Jul. 17, 2015, as Appl. No. 14/801,847. | ||
| Claims priority of provisional application 62/026,020, filed on Jul. 17, 2014. | ||
| Claims priority of application No. 103141420 A (TW), filed on Nov. 28, 2014. | ||
| Prior Publication US 2016/0018348 A1, Jan. 21, 2016 | ||
| Int. Cl. G06F 3/044 (2006.01) | ||
| CPC G06F 3/044 (2013.01) [G06F 2203/04112 (2013.01); G06F 2203/04113 (2013.01)] | 33 Claims |
| 1. A sensing structure, comprising:
a sensing unit;
a periphery circuit; and
a connecting circuit, comprising a connecting pattern and configured to connect the sensing unit and the periphery circuit,
wherein the connecting pattern has at least two line widths, the line width of a part of the connecting pattern that connects
the periphery circuit is greater than the line width of a part of the connecting pattern that connects the sensing unit, and
a line thickness of the connecting pattern is increased as the line width of the connecting pattern is increased.
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